1. 2. 3. material content data sheet sales product name ipa030n10n3 g issued 29. august 2013 ma# MA000800284 package pg-to220-3-111 weight* 2233.32 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 15.455 0.69 0.69 6920 6920 leadframe non noble metal iron 7439-89-6 1.120 0.05 501 inorganic material phosphorus 7723-14-0 0.336 0.02 150 non noble metal copper 7440-50-8 1118.332 50.07 50.14 500748 501399 wire non noble metal aluminium 7429-90-5 9.385 0.42 0.42 4202 4202 encapsulation organic material carbon black 1333-86-4 2.237 0.10 1002 plastics epoxy resin - 203.091 9.09 90937 inorganic material silicondioxide 60676-86-0 870.037 38.96 48.15 389571 481510 leadfinish non noble metal tin 7440-31-5 7.942 0.36 0.36 3556 3556 plating non noble metal nickel 7440-02-0 0.305 0.01 137 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 137 solder non noble metal antimony 7440-36-0 0.508 0.02 228 noble metal silver 7440-22-4 1.271 0.06 569 non noble metal tin 7440-31-5 3.304 0.15 0.23 1479 2276 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
